[MI TECHNOVATION BERHAD：在晶圆级封装（WLP）等先进封装领域的新参与者和新产品的带动下，2019年下半年的活动有所改善；他们的订单可见性目前约为2个月，被认为是健康的]
3Q19 vs 3Q18:
YTD19 vs YTD18：
3Q19 vs 2Q19：
对于Mi Equipment旗下的半导体部门，他们还将不断增加新客户，并将新系列推向现有客户。与他们新的Bayan Lepas工厂相比，他们的产量比去年翻了一番。借助Mi Autobotics，他们现在可以将其客户群扩大到其他领域，例如需要启用工业4.0的自动化或机器人解决方案的制造业。在技术工人稀缺或要求更高工资的地区，将非常需要这些解决方案。此外，Mi Components将直接针对消费市场生产产品，从而进一步扩大其客户基础，超越半导体行业。
James Ng Stock Pick Performance:
Since Recommended Return:
a) FRONTKN (FRONTKEN CORP BHD), recommended on 12 Aug 18, initial price was RM0.715, rose to RM2.12 (dividend RM0.025) in 1 year 3 months 22 days, total return is 200%
b) PRLEXUS (PROLEXUS BHD), recommended on 25 Aug 19, initial price was RM0.455, rose to RM1.02 in 3 months 9 days, total return is 124.2%
c) JAKS (JAKS RESOURCES BHD), recommended on 20 Jan 19, initial price was RM0.575, rose to RM1.25 in 10 months 14 days, total return is 117.4%
d) KKB (KKB ENGINEERING BHD), recommended on 1 Jul 18, initial price was RM0.795, rose to RM1.44 (dividend RM0.04) in 1 year 5 months 3 days, total return is 86.2%
e) PWROOT (POWER ROOT BHD), recommended on 7 Oct 18, initial price was RM1.59, rose to RM2.39 (dividends RM0.083) in 1 Year 1 month 27 days, total return is 55.5%
f) MI (MI TECHNOVATION BERHAD), recommended on 2 Jun 19, initial price was RM1.67, rose to RM2.55 (adjusted)(dividend RM0.01) in 6 months 2 days, total return is 53.3%
g) GBGAQRS (GABUNGAN AQRS BHD), recommended on 16 Dec 18, initial price was RM0.80, rose to RM1.15 in 11 months 18 days, total return is 43.8%
h) ELKDESA (ELK-DESA RESOURCES BHD), recommended on 18 Nov 18, initial price was RM1.27, rose to RM1.69 (dividend RM0.07) in 1 Year 16 days, total return is 38.6%
i) KGB (KELINGTON GROUP BHD), recommended on 23 Dec 18, initial price was RM0.965, rose to RM1.31 (dividend RM0.018) in 11 months 11 days, total return is 37.6%
j) TSH (TSH RESOURCES BHD), recommended on 30 Jun 19, initial price was RM0.90, rose to RM1.18 in 5 months 4 days, total return is 31.1%
k) PESTECH (PESTECH INTERNATIONAL BHD), recommended on 2 Jun 19, initial price was RM1.04, rose to RM1.26 in 6 months 2 days, total return is 21.2%
l) BAUTO (BERMAZ AUTO BHD), recommended on 14 Oct 18, initial price was RM1.89, rose to RM2.05 (dividend RM0.22) in 1 Year 1 month 20 days, total return is 20.1%
m) SWKPLNT (SARAWAK PLANTATION BHD), recommended on 24 Mar 19, initial price was RM1.55, rose to RM1.72 (dividend RM0.05) in 8 months 10 days, total return is 14.2%
n) SERBADK (SERBA DINAMIK HOLDINGS BHD), recommended on 29 Jul 18, initial price was RM3.96, rose to RM4.22 (adjusted)(dividends RM0.111) in 1 Year 4 months 5 days, total return is 9.4%
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[MI TECHNOVATION BERHAD: Activities have improved in second half of 2019, led by new players and products in the advanced packaging segment such as wafer level packaging (“WLP”); order visibility is currently around 2 months, which is considered healthy]
3Q19 vs 3Q18:
The Group's revenue for the current quarter closed at RM47.30 million or 14% increase year-on‐year. This was mainly due to stronger demand from their customers in North East Asia region as a result of the growth in capital investment from certain OSATs in the advanced/wafer level packaging segment.
The Group’s profit before tax (“PBT”) for the current quarter was RM17.55 million or 25% increase from RM14.05 million recorded in the similar quarter of the preceding year. The better performance was due to manufacturing efficiencies and a change in geographical sales mix resulting in lower commission payable to external sales agents in the quarter under review.
YTD19 vs YTD18:
The year‐to‐date revenue and PBT was RM122.92 million and RM41.83 million respectively, i.e. a 5% drop in revenue but 12% increase in PBT. The PBT increase was due to operations efficiencies and change in geographical sales mix resulting in lower commission payable to external sales agent.
3Q19 vs 2Q19:
The Group posted a revenue of RM47.30 million and PBT of RM17.55 million for the current quarter under review, compared to RM46.13 million and RM17.38 million for the immediate preceding quarter. Both revenue and PBT have slightly increased by 3% and 1% respectively due to higher sales and impact from foreign exchange gains.
Activities have improved in second half of 2019, led by new players and products in the advanced packaging segment such as wafer level packaging (“WLP”). Although it is widely reported that the semiconductor industry in general is experiencing slowdown in 2019, but capital investment from certain OSATs in the advanced /WLP segment is still growing, and this augurs well for them. Their order visibility is currently around 2 months, which is considered healthy.
They will see momentum increase when 5G is being rolled‐out and this will be the game changer which requires new assembly and packaging processes, leading to better prospects for semiconductor equipment makers. Ultimately, higher performance gadgets will require more advanced technology and higher density of semiconductor content, which is supported by advanced level packaging equipment manufacturers such as Mi Equipment.
For their semiconductor division under Mi Equipment, they are also continuously adding new clients and introducing their new series to existing clients. They have doubled the production output as compared to last year in their new Bayan Lepas plant. With Mi Autobotics, they can now widen their client base to other sectors such as manufacturing which requires Industrial 4.0 enabled automation or robotics solutions. These solutions will be much needed in regions where skilled labour is scarce or demands higher wages. Furthermore, Mi Components will produce products targeting the consumer market directly, further broadening their customer base beyond the semiconductor industry.
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